About
About
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Technology & Services
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Flip Chip Packaging Technology
Superior Memory Packaging
Wafer Bumping
Wirebond Packaging
Technology & Solutions
Technology & Services
Turnkey Services
Test Services
Design Services
Packaging Services
Semiconductor Package Integration Design
Wafer Probing
Wafer Bumping
Assembly
Global Drop Shipping
Technology
Advanced 2.5D / 3D Packaging Solutions
Ultra High-Density Advanced SiP Technology
Ultra-Thin Wafer Level Packaging Technology
High-Performance Flip Chip Technology
Superior Memory Packaging Technology
Sustainability
Sustainability
Green Manufacturing
Conflict-Free Mineral Policy
ESG
ESG
ESG
Green Manufacturing
Responsible Sourcing
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Contact Us
Worldwide Locations
Strategically positioned across Asia, Europe, and North America to
support global innovation.
STATS ChipPAC Korea
STATS ChipPAC Korea +
South Korea
STATS ChipPAC Global HQ
STATS ChipPAC Singapore
Singapore
STATS ChipPAC Korea
STATS ChipPAC Korea
Incheon, South Korea
Certifications
ISO 9001 SCK
|
IATF 16949 SCK
|
ISO 14001 SCK
|
ISO 45001 SCK
|
ISO 22301 SCK
|
ISO 27001 SCK
|
ESD S20.20 SCK
|
Samsung Eco Partner
|
RBA SCK
|
ISO 14064-1:2018 (GHG Emission Review)
STATS ChipPAC Korea +
STATS ChipPAC Korea +
Incheon, South Korea
Certifications
ISO 9001 SCK
|
IATF 16949 SCK
|
ISO 14001 SCK
|
ISO 45001 SCK
|
ISO 22301 SCK
|
ISO 27001 SCK
|
ESD S20.20 SCK
|
Samsung Eco Partner
|
RBA SCK
|
ISO 14064-1:2018 (GHG Emission Review)
STATS ChipPAC Singapore
STATS ChipPAC Singapore
Singapore
Certifications
ISO 9001 SCK
|
IATF 16949 SCK
|
ISO 14001 SCK
|
ISO 45001 SCK
|
ISO 22301 SCK
|
ISO 27001 SCK
|
ESD S20.20 SCK
|
Samsung Eco Partner
|
RBA SCK
|
ISO 14064-1:2018 (GHG Emission Review)
