HPC innovation is accelerating demand for energy-efficient chips—making advanced packaging a central driver of scalable, high-performance systems. STATS ChipPAC delivers integrated solutions backed by a robust patent portfolio, large-scale production, and a technology roadmap spanning compute, memory, power, and connectivity.

Our XDFOI® high-density fan-out chiplet platform is in stable mass production today. It integrates package assembly and testing across 2D, 2.5D, and 3D technologies to enable high-bandwidth, high-efficiency computing systems.