Advanced Packaging Solutions for Next-Generation Devices

As the demand for highly integrated and compact semiconductor devices grows, STATS ChipPAC leverages its cutting-edge wafer-level technologies—including FIWLP, FOWLP, IPD, and TSV—to provide reliable, high-performance, and cost-efficient packaging solutions that meet the changing needs of next-generation applications.

Tailor-fit Services to
Meet Your Requirements

Our packaging services support diverse applications across consumer electronics, automotive, and IoT industries.
Discover our comprehensive packaging solutions below.

Automotive

Our semiconductor solutions support the advancement of autonomous and connected vehicles with a focus on quality standards.

Automotive

Our semiconductor solutions support the advancement of autonomous and connected vehicles with a focus on quality standards.

Automotive

Our semiconductor solutions support the advancement of autonomous and connected vehicles with a focus on quality standards.

Turnkey Services

STATS ChipPac streamlines semiconductor manufacturing with end-to-end solutions, from IC design to final testing and packaging.

Explore All Technologies

Find out how else we can help your organization.

2.5/3D Integration

Integrate multiple components into a single compact package.

System-in-Package

Integrate multiple components into a single compact package.

Flip Chip PackagingTechnology

Integrate multiple components into a single compact package.

Superior Memory Packaging

Integrate multiple components into a single compact package.

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