Advanced Packaging Solutions for Next-Generation Devices

As the demand for highly integrated and compact semiconductor devices grows, STATS ChipPAC leverages its cutting-edge wafer-level technologies—including FIWLP, FOWLP, IPD, and TSV—to provide reliable, high-performance, and cost-efficient packaging solutions that meet the changing needs of next-generation applications.

Tailor-fit Services to
Meet Your Requirements

Our packaging services support diverse applications across consumer electronics, automotive, and IoT industries.  Discover our comprehensive packaging solutions below.

Wafer Level Packaging

Our wafer level packaging services deliver unmatched performance, integrating FIWLP and FOWLP technologies to create smaller, faster, and more efficient devices.

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System-in-Package

Smarter package design for advanced devices. Simulation-driven insights to optimize reliability, performance, and cost.

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Flip Chip Packaging

Full-spectrum packaging capabilities, including FIWLP, FOWLP, and TSV-based platforms. Built to enable complex, compact systems without compromising speed, quality, or cost.

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Wirebond Packaging

Comprehensive test solutions across RF, analog, mixed-signal, and digital devices. High-throughput platforms engineered to reduce cost, accelerate ramp, and ensure quality at scale.

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MEMS and Sensors Packaging

Comprehensive test solutions across RF, analog, mixed-signal, and digital devices. High-throughput platforms engineered to reduce cost, accelerate ramp, and ensure quality at scale.

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