Turnkey Services

Our comprehensive solutions and services 
cater to the needs of modern electronics manufacturers.

World-class turnkey services that bring the most value

Turnkey solutions simplify the semiconductor process, helping customers save time, reduce costs, and manage their supply chains more effectively. At Stats ChipPAC, we provide end-to-end services, from package design to global delivery, to delivery value to automotive, AI, and healthcare industries.

Pioneering Semiconductor Solutions
for Global Organisations

Our turnkey services encompass wafer bumping, probing, assembly, testing, and direct shipping, covering all stages of semiconductor production. We provide advanced packaging solutions such as wafer-level, laminate, and leadframe options that are engineered for various applications.

Faster time to market

Higher reliability and yield

Improve overall efficiency

Lower costs

Simplify product management

Globally Present
to Meet Your Needs

We are present in major global markets, including China, South Korea, Singapore, the United States, and several European countries such as the United Kingdom, Netherlands, and France, enabling us to serve clients no matter where they are located.

Global Presence

The scale and scope of JCET’s technical capabilities and global reach enables it to provide customers with seamless cost-effective solutions that will simplify their supply chain management. With strategic manufacturing presence in China, Korea, Singapore, and customer support offices throughout the United States, Europe, and Asia, JCET can provide total turnkey solutions tailored to your needs.

Supply Chain Management

JCET delivers value across its customers’ supply chain by enabling efficient information exchange,  inventory visibility, and transactions through its e-business solutions. This allows customers to make better decisions faster, increase productivity and reduce wasted resources that impact their bottom line.

Explore All Services

Find out how else we can help your organization.

2.5/3D Integration

Integrate multiple components into a single compact package.

System-in-Package

Integrate multiple components into a single compact package.

Flip Chip PackagingTechnology

Integrate multiple components into a single compact package.

Superior Memory Packaging

Integrate multiple components into a single compact package.
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