About
About
Culture & Values
Leadership Team
Worldwide Locations
Ethics & Compliance
Careers
Applications
Applications
Automotive
Computing
Memory
AI Edge
Power & Energy
Technology and Solutions
Technology
Wirebond Packaging
Flip Chip Packaging
Wafer Bumping
Wafer Level Packaging
System-in-Package
MEMS & Sensors Packaging
2.5/3D Packaging
Solutions
Turnkey Solutions
Design Solutions
Packaging Solutions
Test Solutions
Technology & Solutions
Technology & Services
Turnkey Services
Test Services
Design Services
Packaging Services
Semiconductor Package Integration Design
Wafer Probing
Wafer Bumping
Assembly
Global Drop Shipping
Technology
Advanced 2.5D / 3D Packaging Solutions
Ultra High-Density Advanced SiP Technology
Ultra-Thin Wafer Level Packaging Technology
High-Performance Flip Chip Technology
Superior Memory Packaging Technology
Sustainability
Sustainability
Green Manufacturing
Conflict-Free Mineral Policy
ESG
ESG
ESG
Green Manufacturing
Responsible Sourcing
Newsroom
Contact Us
Wafer Bumping
Foundational process technology for high-yield advanced packaging
Connection begins at the wafer.
Wafer bumping technology delivers significant advantages in performance, form factor, and cost for semiconductor packages.
Inside the Technology
Broad experience across wafer bump alloys and processes, including printed bump, ball drop, and plated approaches
Support for eutectic, lead-free, and copper pillar bump alloys
Wafer bumping and redistribution services for 200 mm and 300 mm wafer sizes
Enablement of full turnkey advanced flip chip and wafer-level packaging solutions
Applications
AI
Data Centers
Blockchain
ADAS
AI
Data Centers
Blockchain
Downloads
Lorem Ipsum Dolor Sit Amet
Lorem Ipsum Dolor Sit Amet
Lorem Ipsum Dolor Sit Amet
Lorem Ipsum Dolor Sit Amet
Lorem Ipsum Dolor Sit Amet
Lorem Ipsum Dolor Sit Amet
Explore All Technologies
Wirebond Packaging
Reliable, cost-effective interconnects trusted in high-volume manufacturing.
Flip Chip Packaging
High-density, high-performance interconnects for advanced miniaturization.
Wafer Bumping
Foundational process technology for high-yield advanced packaging.
Wafer Level Packaging
Advanced performance in ultra-compact form factors.
System-in-Package (SiP)
High-density integration without trade-offs in performance or footprint.
MEMS & Sensors Packaging
Compact, integrated packaging for intelligent sensing and control.
2.5/3D Packaging
Higher density, better performance, and more efficient integration.
