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Wafer Bumping
Foundational process technology for high-yield advanced packaging
Connection begins at the wafer.
Wafer bumping technology delivers significant advantages in performance, form factor, and cost for semiconductor packages.
Inside the Technology
Package Level Integration
Wafer level packaging formats
including Fan-in WLP (FIWLP) and Fan-out WLP (FOWLP)
Embedded component and interconnect technologies
such as Integrated Passive Devices (IPD) and Through-Silicon Via (TSV)
Specialized package solutions
including Encapsulated Chip Package (ECP) and RFID packaging
Enablement of full turnkey
advanced flip chip and wafer-level packaging solutions
Inside the Technology
Broad experience
across wafer bump alloys and processes, including printed bump, ball drop, and plated approaches
Support for
eutectic, lead-free, and copper pillar bump alloys
Wafer bumping
and redistribution services for 200 mm and 300 mm wafer sizes
Enablement of full turnkey
advanced flip chip and wafer-level packaging solutions
Inside the Technology
Broad experience
across wafer bump alloys and processes, including printed bump, ball drop, and plated approaches
Support for
eutectic, lead-free, and copper pillar bump alloys
Wafer bumping
and redistribution services for 200 mm and 300 mm wafer sizes
Enablement of full turnkey
advanced flip chip and wafer-level packaging solutions
Applications
AI
Data Centers
Blockchain
ADAS
AI
Data Centers
Blockchain
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Explore All Technologies
2.5D / 3D Integration
Integrate multiple components into a single compact package.
System-in-Package (SiP)
Integrate multiple components into a single compact package.
Wafer Level Packaging
Integrate multiple components into a single compact package.
High-Performance Flip Chip Technology
Integrate multiple components into a single compact package.
Superior Memory Packaging Technology
Integrate multiple components into a single compact package.
Wirebond Packaging
Integrate multiple components into a single compact package.
Wafer Bumping
Integrate multiple components into a single compact package.
