Memory

Driving what memory demands.

With over 20 years of experience in memory packaging, STATS ChipPAC supports stable, high-yield production for NAND Flash and DRAM. We partner with the world’s leading memory manufacturers to accelerate product development and deliver reliable, high-volume solutions for next-generation storage systems.

Packaging & Technology Portfolio

Where proven solutions meet evolving demands.

Memory

NAND Flash, DRAM, …

FBGA

WBBGA

3D NAND

Key Capabilities

Vertical die-stack technology with high Si stacking structure

Deep expertise in Flash and DRAM products

Ultra-thin chip processing at industry-leading precision

Partnerships with the world’s top three memory manufacturers

Application-Specific Advantages

  • Experienced in Flash & DRAM Product
  • Die-Stack Technology Leader
  • Complete Silver WB Portfolio
  • Serving Top 3 Memory OEMs
  • Facilities in Singapore & S. Korea

Explore Key Applications

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