High-Performance Testing for Complex Semiconductor Devices

STATS ChipPac delivers comprehensive test solutions ranging from wafer probes to system-level testing. With our state-of-the-art platforms and engineering expertise, we help customers improve throughput and accelerate time-to-market in the most cost-effective way.

Optimised Testing Services.
Maximum Efficiency.

At STATS ChipPac, we leverage our expertise to deliver the lowest cost of test (COT) with maximum throughput. Discover what we can do for you below.

Front-End Development

Expert test development and consultation services to ensure efficient and reliable testing processes from the start.

Wafer-Level Testing

Advanced wafer testing, including bumped wafers and known good die (KGD) solutions for seamless integration into stacked packages.

Final Testing

Precision testing of simple and advanced packages with automated systems that minimise yield losses and ensure accuracy.

Post-Test Services

Optimised post-test solutions that ensure the customers’ faster product delivery and enhanced supply chain efficiency.

System-Level Testing

Comprehensive system-level testing with high throughput and cost-efficient processes to meet production demands.

Explore All Services

Find out how else we can help your organization.

2.5/3D Integration

Integrate multiple components into a single compact package.

System-in-Package

Integrate multiple components into a single compact package.

Flip Chip PackagingTechnology

Integrate multiple components into a single compact package.

Superior Memory Packaging

Integrate multiple components into a single compact package.

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