System integration, unified.

System-in-Package (SiP) integrates multiple ICs and components into a single compact module to deliver higher system performance, expanded functionality, lower power consumption, and reduced form factor. By consolidating logic, memory, RF, sensors, and passives within one unified package or sub-system, SiP enables faster processing, improved efficiency, and meaningful space savings inside advanced electronic devices.

Inside the Technology

Package Level Integration

Double-sided molding reduces package size, shortens interconnect distances between dies and passives, lowers resistance, and enhances overall electrical performance
EMI shielding uses back-metallization to improve thermal conductivity and effectively isolate electromagnetic interference
Laser-assisted bonding (LAB) addresses limitations of traditional reflow—mitigating CTE mismatch, warpage, thermal-mechanical stress, and other reliability challenges
Enablement of full turnkey advanced flip chip and wafer-level packaging solutions

Inside the Technology

Broad experience across wafer bump alloys and processes, including printed bump, ball drop, and plated approaches
Support for eutectic, lead-free, and copper pillar bump alloys
Wafer bumping and redistribution services for 200 mm and 300 mm wafer sizes
Enablement of full turnkey advanced flip chip and wafer-level packaging solutions

Inside the Technology

Broad experience across wafer bump alloys and processes, including printed bump, ball drop, and plated approaches
Support for eutectic, lead-free, and copper pillar bump alloys
Wafer bumping and redistribution services for 200 mm and 300 mm wafer sizes
Enablement of full turnkey advanced flip chip and wafer-level packaging solutions

Technical Highlights

Package Level Integration

Package miniaturization via advanced SMT, wire bonding, and flip-chip, supporting minimum component size 008004, 45 µm spacing, and ±15 µm placement accuracy
Dual-sided SiP (pin- or pad-based) enabling reduced footprint, shorter routing, and improved signal integrity, with backside-exposed chips for thinner packages and better thermal performance
High-performance fan-out WLP (eWLB and ECP) delivering strong bandwidth, performance, size, and cost advantages

Package Level Integration

EMI-shielding options—conformal coatings, partitioned shields, localized overmold—to optimize signal integrity
Heterogeneous integration of logic, digital, analog, power management, and memory chips within a single package
eWLCSP™ enhances CSP reliability, while WLCSP improves density.