Fit-for-Purpose Designs without Compromising Functionality

As semiconductor packages become smaller, faster, and more powerful, STATS ChipPAC's global characterisation teams in China, Singapore, South Korea, and the U.S. provide advanced analysis and simulation services to deliver reliable, high-performance, and cost-effective designs that adhere to industry standards.

Topnotch Designs that
Provide Exceptional Value

STATS ChipPac partners with clients to deliver top-quality designs that offer the best value for your buck.  Here's what we can do for you.

Design Services

We deliver bespoke design solutions that meet your specific requirements.

Customer-Centric Designers

Mobile Design Capability

State-of-the-Art Design Tools

Integration of Customer-Supplied Designs

Project data management

Characterisation Services

Our team provides characterisation services that ensure reliable performance.

Thermal Analysis

Mould Flow Analysis

Mechanical Analysis

Electrical Analysis

How Our Services Changed the World

Proven Experience

Our expert design team serves mobile, networking, computing, consumer, and automotive markets. We specialise in laminate, leadframe, and wafer-level designs, including PoP, IPD, and advanced SiP solutions, delivering cost-effective and reliable designs to our clients

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Design for Performance

Smarter package design for advanced devices. Simulation-driven insights to optimize reliability, performance, and cost.

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Design Process

Full-spectrum packaging capabilities, including FIWLP, FOWLP, and TSV-based platforms. Built to enable complex, compact systems without compromising speed, quality, or cost.

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Design Tool Sets

Comprehensive test solutions across RF, analog, mixed-signal, and digital devices. High-throughput platforms engineered to reduce cost, accelerate ramp, and ensure quality at scale.

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