Proven by scale and longevity.

Wire bonding forms electrical interconnections from chip to substrate, substrate to substrate, or substrate to package. Known for its flexibility and cost efficiency, it remains one of the most widely used interconnect technologies across semiconductor packaging.

Inside the Technology

Package Level Integration

Wire bond interconnect options using gold, silver, copper, and other metal wires across multiple packaging approaches
Copper wire as a preferred, cost-effective alternative to gold in wire bond packaging
Comparable electrical characteristics and performance between copper and gold wire
Lower wire resistance supporting improved device performance in resistance-sensitive applications

Inside the Technology

Broad experience across wafer bump alloys and processes, including printed bump, ball drop, and plated approaches
Support for eutectic, lead-free, and copper pillar bump alloys
Wafer bumping and redistribution services for 200 mm and 300 mm wafer sizes
Lower wire resistance supporting improved device performance in resistance-sensitive applications

Inside the Technology

Broad experience across wafer bump alloys and processes, including printed bump, ball drop, and plated approaches
Support for eutectic, lead-free, and copper pillar bump alloys
Wafer bumping and redistribution services for 200 mm and 300 mm wafer sizes
Lower wire resistance supporting improved device performance in resistance-sensitive applications

Technical Highlights

Package Level Integration

Packaging types including discrete devices, QFN, DFN, QFP, WB-BGA, and WB-LGA
Compatibility with thin substrates, leadframes, and MIS substrates
Mass production solutions applied across power devices, MEMS & sensors, memory, mobile communications, automotive, and related applications

Package Level Integration

Wire materials including aluminum, gold, silver, copper, palladium-coated copper, and gold-palladium-coated copper
Mature HVM experience with shipments exceeding hundreds of billions of units
eWLCSP™ enhances CSP reliability, while WLCSP improves density.