Where physical and digital meet.

MEMS and Sensors are increasingly central to smart, connected devices that require precise sensing, communication, and control. Their smaller footprint, thinner profile, and high functional integration make advanced packaging essential across applications in communications, consumer electronics, medical devices, industrial systems, and automotive platforms.

Inside the Technology

Package Level Integration

Turnkey support including package co-design, simulation, BOM qualification, assembly, quality assurance, and in-house testing
Manufacturing and test capabilities built around rigorous process control and integrated MEMS workflows
Compact, high-integration designs that enable smaller form factors and strong system performance for MEMS and sensor modules
Cost-efficient solutions developed to meet critical size, performance, and cost requirements

Inside the Technology

Broad experience across wafer bump alloys and processes, including printed bump, ball drop, and plated approaches
Support for eutectic, lead-free, and copper pillar bump alloys
Wafer bumping and redistribution services for 200 mm and 300 mm wafer sizes
Cost-efficient solutions developed to meet critical size, performance, and cost requirements

Inside the Technology

Broad experience across wafer bump alloys and processes, including printed bump, ball drop, and plated approaches
Support for eutectic, lead-free, and copper pillar bump alloys
Wafer bumping and redistribution services for 200 mm and 300 mm wafer sizes
Cost-efficient solutions developed to meet critical size, performance, and cost requirements