About

Culture & Values Leadership Team Worldwide Locations Ethics & Compliance Careers

Applications

Automotive Computing Memory AI Edge Power & Energy

Technology and Solutions

Technology

Wirebond Packaging Flip Chip Packaging Wafer Bumping Wafer Level Packaging System-in-Package MEMS & Sensors Packaging 2.5/3D Packaging

Solutions

Turnkey Solutions Design Solutions Packaging Solutions Test Solutions

Technology & Solutions

Technology & Services

Turnkey Services Test Services Design Services Packaging Services Semiconductor Package Integration Design Wafer Probing Wafer Bumping Assembly Global Drop Shipping

Technology

Advanced 2.5D / 3D Packaging Solutions Ultra High-Density Advanced SiP Technology Ultra-Thin Wafer Level Packaging Technology High-Performance Flip Chip Technology Superior Memory Packaging Technology

Sustainability

Green Manufacturing Conflict-Free Mineral Policy ESG

ESG

Green Manufacturing Responsible Sourcing

Newsroom Contact Us

Press Release

2024

Financial Reports

STATS ChipPAC Korea Powers Up Phase | Solar Project to Drive Green Growth

September 5, 2025

2024

Financial Reports

About Applications Technology & Solutions Sustainability Newsroom Contact Us

Copyright © 2026, STATS ChipPAC Management Pte. Ltd.