Streamline semiconductor assembly with cost-effective, flexible wirebond interconnections.

Achieve high-density interconnects and improved electrical and thermal performance.

Enhance miniaturisation and power distribution with wafer bumping to enable direct attachment for advanced packaging solutions.

Integrate multiple circuits into a compact system to boost performance, functionality, and processing speeds.

Enable next-gen smart devices with MEMS and sensor packaging, designed for diverse industries.

Maximise performance by stacking and interconnecting components.

Improve power and analogue device performance with high-temperature, advanced packaging solutions.

Refine mainstream packaging with advanced process control to improve performance, lower costs, and expand application potential.